Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers /

Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers /

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Bibliographic Details
Main Author: Franke, Jörg (Prof. Dr.-Ing.) (Author)
Format: Electronic eBook
Language:English
German
Published: Munich ; Cincinnati, OH : Hanser, [2014]
Subjects:
Interconnects (Integrated circuit technology) > Design and construction.
Injection molding of plastics.
Online Access:CONNECT

Internet

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