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  1. 1
    Semiconductor Packaging : Materials Interaction and Reliability.

    Semiconductor Packaging : Materials Interaction and Reliability. by Chen, Andrea

    Published 2011
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  2. 2
    IC component sockets /

    IC component sockets / by Liu, Weifeng

    Published 2004
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    Electronic eBook

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  3. 3
    Adhesion in microelectronics /

    Adhesion in microelectronics /

    Published 2014
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    Electronic eBook

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  4. 4
    Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /

    Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / by Liu, S. 1963-

    Published 2011
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    Electronic eBook

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  5. 5
    Semiconductor packaging : materials interaction and reliability /

    Semiconductor packaging : materials interaction and reliability / by Chen, Andrea

    Published 2012
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  6. 6
    Antenna-in-package technology and applications /

    Antenna-in-package technology and applications /

    Published 2020
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    Electronic eBook

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  7. 7
    Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package /

    Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package /

    Published 2021
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    Electronic eBook

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  8. 8
    Advanced packaging : an IHS Group publication.

    Advanced packaging : an IHS Group publication.

    Published 1992
    Full Text Availability
    Electronic Journal

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  9. 9
    Microelectronics packaging handbook /

    Microelectronics packaging handbook /

    Published 1989
    Book

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  10. 10
    New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 /

    New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 /

    Published 1990
    Conference Proceeding Book

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  11. 11
    Proceedings of the International Symposium on Advances in Interconnection and Packaging, 5-9 November 1990, Boston, Massachusetts /

    Proceedings of the International Symposium on Advances in Interconnection and Packaging, 5-9 November 1990, Boston, Massachusetts /

    Published 1991
    Conference Proceeding Book

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  12. 12
    Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

    Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / by Lau, John H.

    Published 2000
    Book

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  13. 13
    Fundamentals of microfabrication : the science of miniaturization /

    Fundamentals of microfabrication : the science of miniaturization / by Madou, Marc J.

    Published 2002
    Book

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  14. 14
    Microelectronics packaging handbook /

    Microelectronics packaging handbook /

    Published 1997
    Book

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  15. 15
    Microvias : for low cost, high density interconnects /

    Microvias : for low cost, high density interconnects / by Lau, John H.

    Published 2001
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  16. 16
    Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches /

    Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches / by Knight, Ryan, Cheng, Evan

    Published 2014
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    Government Document Electronic eBook

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  17. 17
    Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability /

    Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability /

    Published 2018
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    Electronic eBook

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  18. 18
    LCP for microwave packages and modules /

    LCP for microwave packages and modules /

    Published 2012
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    Electronic eBook

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  19. 19
    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    Published 2014
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    Electronic Conference Proceeding eBook

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  20. 20
    Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 /

    Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya,...

    Published 2011
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    Electronic Conference Proceeding eBook

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