Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /

Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /

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Bibliographic Details
Corporate Author: Electronic Packaging Interconnect Technology Symposium Fukuoka)
Other Authors: Nogita, Kazuhiro (Editor), Salleh, Mohd Arif Anuar Mohd (Editor), Abdullah, Mohd Mustafa Al Bakri (Editor), Jamaludin, Liyana (Editor), Mohd Tahir, Muhammad Faheem (Editor)
Format: Conference Proceeding eBook
Language:English
Published: Zurich Trans Tech Publications Ltd [2018]
Series:Diffusion and defect data. Solid state phenomena ; volume 273.
Subjects:
Electronic packaging > Congresses.
Electronic packaging > Materials > Congresses.
Conference papers and proceedings.
Online Access:CONNECT
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Internet

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