Microvias : for low cost, high density interconnects /
Saved in:
Main Author: | Lau, John H. |
---|---|
Corporate Author: | NetLibrary, Inc |
Other Authors: | Lee, S. W. Ricky |
Format: | Electronic eBook |
Language: | English |
Published: |
New York :
McGraw-Hill,
2001.
|
Subjects: | |
Online Access: | CONNECT |
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