New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 /

New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 /

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Bibliographic Details
Corporate Authors: International Electronic Materials and Processing Congress San Francisco, Calif.), ASM International. Electronic Materials and Processing Division.
Other Authors: Livesay, B. R., Nagarkar, M. D.
Format: Conference Proceeding Book
Language:English
Published: Materials Park, Ohio : ASM International, c1990.
Subjects:
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
Microelectronics > Corrosion > Congresses.

Main Collection - Walker Library - 4th Floor

Holdings details from Main Collection - Walker Library - 4th Floor
Call Number: 621.381046 In8 1990
Copy 1 Available  Pull and Hold

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