Electronic packaging science and technology /
"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic pa...
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| Main Authors: | , , |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Hoboken, NJ :
John Wiley & Sons, Inc.,
2022.
|
| Subjects: | |
| Online Access: | CONNECT CONNECT |
| LEADER | 03192nam a2200565 i 4500 | ||
|---|---|---|---|
| 001 | in00006121318 | ||
| 006 | m o d | ||
| 007 | cr cnu---unuuu | ||
| 008 | 210916t20222022nju ob 001 0 eng | ||
| 005 | 20220506190832.0 | ||
| 010 | |a 2021039115 | ||
| 035 | |a (NhCcYBP)5d50d7e5b45a4165915fe73ab9482d3f9781119418344 | ||
| 035 | |a 1wileyeba9781119418344 | ||
| 040 | |a DLC |b eng |e rda |c DLC | ||
| 020 | |a 9781119418344 | ||
| 020 | |a 1119418348 |q electronic book | ||
| 020 | |a 9781119418337 |q electronic book | ||
| 020 | |a 111941833X |q electronic book | ||
| 020 | |a 9781119418320 |q electronic book | ||
| 020 | |a 1119418321 |q electronic book | ||
| 020 | |z 9781119418313 |q hardcover | ||
| 024 | 7 | |a 10.1002/9781119418344 |2 doi | |
| 042 | |a pcc | ||
| 050 | 0 | 0 | |a TK7870.15 |b .T85 2022 |
| 082 | 0 | 0 | |a 621.381/046 |2 23 |
| 100 | 1 | |a Tu, K. N. |q (King-Ning), |d 1937- |e author. | |
| 245 | 1 | 0 | |a Electronic packaging science and technology / |c King-Ning Tu, Chih Chen, Hung-Ming Chen. |
| 264 | 1 | |a Hoboken, NJ : |b John Wiley & Sons, Inc., |c 2022. | |
| 264 | 4 | |c ©2022 | |
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a "This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"-- |c Provided by publisher. | ||
| 588 | |a Description based on online resource; title from digital title page (viewed on April 14, 2022). | ||
| 590 | |a Wiley EBA | ||
| 650 | 0 | |a Electronic packaging. | |
| 700 | 1 | |a Chen, Chih, |d 1970- |e author. | |
| 700 | 1 | |a Chen, Hung-Ming, |e author. | |
| 730 | 0 | |a WILEYEBA | |
| 776 | 0 | 8 | |i Print version: |a Tu, K. N. 1937- |t Electronic packaging science and technology |b 1st edition. |d Hoboken, NJ : Wiley, 2022 |z 9781119418313 |w (DLC) 2021039114 |
| 856 | 4 | 0 | |u https://ezproxy.mtsu.edu/login?url=https://onlinelibrary.wiley.com/book/10.1002/9781119418344 |z CONNECT |3 Wiley |t 0 |
| 949 | |a ho0 | ||
| 975 | |p Wiley UBCM All Titles thru 2021 | ||
| 976 | |a 6005108 | ||
| 998 | |a wi |d z | ||
| 999 | f | f | |s a6c67e07-ab55-48f7-ab51-450cb9d95cf3 |i a6c67e07-ab55-48f7-ab51-450cb9d95cf3 |t 0 |
| 952 | f | f | |a Middle Tennessee State University |b Main |c James E. Walker Library |d Electronic Resources |t 1 |e TK7870.15 .T85 2022 |h Library of Congress classification |
| 856 | 4 | 0 | |3 Wiley |t 0 |u https://ezproxy.mtsu.edu/login?url=https://onlinelibrary.wiley.com/book/10.1002/9781119418344 |z CONNECT |
