Industrial system engineering for drones : a guide with best practices for designing /
Explore a complex mechanical system where electronics and mechanical engineers work together as a cross-functional team. Using a working example, this book is a practical "how to" guide to designing a drone system. As system design becomes more and more complicated, systematic, and organiz...
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| Main Authors: | , , |
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| Format: | Electronic eBook |
| Language: | English |
| Published: |
[Berkeley, CA] :
Apress,
2019.
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| Series: | Technology in action series.
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| Subjects: | |
| Online Access: | CONNECT |
Table of Contents:
- Intro; Table of Contents; About the Authors; Acknowledgements; Chapter 1: Introduction; What Is a Drone?; Military; Industrial; Commercial; Parts of a Drone System; Hardware; The SOC; Subsystems; Input; Output; Storage; Communication Devices; Software; Mechanical; Ground-Based Controllers and Accessories; Summary; Chapter 2: Drone System Design Flow; System Design; Requirement Specification; Architecture; Mechanical Design; Hardware Design; Software Design; Implementation; Specifications for Our Drone, "Crop Squad"; Mechanical Design; Definition; Purpose; Requirements; Dependencies
- Hardware DesignHardware Requirements; Electrical Ingredients Selection; BOM and Component Procurement; PCBA Design; PCBA Dimensions; PCB Type; Layer Stack-Up; Floor Plan; Power Architecture; Power Estimation; SOC Power Requirements; Platform Power Requirements; Power Devices; Linear Regulators; Switching Regulators; Choosing the Best Regulator; Power Map; Power Sequencing; Battery Estimation; Battery Constraints; Number of Cells or Voltage; Battery Chemistry; Cell Voltage and Battery Packs; Battery Capacity; Watt Hours and Energy Density; Battery Cost; Software Architecture
- Logistics and Operations ManagementBoard and System Assembly; Demand BOM; Production BOM; Summary; Chapter 3: Key Ingredients and Selection Considerations; System on a Chip; Categories; Key Considerations; Solutions; Memory; Categories; Standard DRAM; First Generation; Second Generation; Third Generation; Fourth Generation; Fifth Generation; Mobile DRAM; Key Considerations; Solutions; Storage; Categories; Magnetic Storage; Optical Storage; Flash Storage; CompactFlash; Multimedia Card; Secure Digital Card; Solid State Drives; USB Flash Storage; Key Considerations; Solutions
- Communication ModuleCategories; WiFi+BT; Mobile Network; IR/RF Wireless; Key Considerations; Solution; Camera; Categories; Monochrome; Color; Spectral Imaging; Key Considerations; Solutions; Display; Categories; Internal; External; Key Considerations; Flight Controllers; Categories; MCU/MPU; FPGA; Key Considerations; Solutions; Battery; Categories; Lead Acid; Nickel Cadmium; Nickel Metal Hydride; Lithium-Ion Batteries; Key Considerations; Solutions; Thermal Solution; Categories; Active Cooling; Passive Cooling; Key Considerations; Solutions; Interconnects; Categories; Cable Connectors; USB
- EthernetBoard-to-Board Connectors; Wire-to-Board Connectors; RF Connectors; FPC/FFC Connectors; Key Considerations; Solutions; Mechanicals; Categories; Key Considerations; Solutions; Summary; Chapter 4: Drone Hardware Development; PCB Library Development; Symbol Creation; Logical Symbol Creation; Symbol Verification; PCB Footprint Creation; Footprint Verification; Schematics Design; Schematics Capture; Design Rules Checking; Generating a Netlist; Bill of Materials; Symbol Attributes; BOM Generation; Material Readiness; Layout Design; Board Outline; Layer Stack-Up; Electrical Constraints
