Chemical mechanical planarization of microelectronic materials /

Chemical mechanical planarization of microelectronic materials /

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Bibliographic Details
Main Author: Steigerwald, Joseph M.
Other Authors: Murarka, S. P., Gutmann, Ronald J.
Format: Electronic eBook
Language:English
Published: New York : J. Wiley, ©1997.
Subjects:
Microelectronics > Materials.
Grinding and polishing.
Chemical mechanical planarization.
Online Access:CONNECT
Description
Item Description:Wiley EBA
Physical Description:1 online resource (xiii, 324 pages) : illustrations
Bibliography:Includes bibliographical references and index.
ISBN:9783527617746
3527617744
9783527617753
3527617752
0471138274
9780471138273

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